Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement.
- Título:
- Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement.
- Materia:
- Computer Science; Engineering & Technology
- Editor:
- CRC Press
- Descripción:
- 240 p.
- Identificadores:
- ISBN: 9780429399619
- Colección:
- Taylor Francis