Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
- Título:
- Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
- Materia:
- Electrical & Electronics Engineering
- Editor:
- Wiley
- Descripción:
- 577 p.
- Identificadores:
- E-ISBN: 9780470827802 ISBN: 9780470827826
- Colección:
- Wiley