Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

Title:
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
Author:
Keser
Subject:
Electrical & Electronics Engineering
Publisher:
Wiley-IEEE Press
Description:
577 p.
Indentifiers:
E-ISBN: 9781119314134 ISBN: 9781119313991
Collection:
Wiley