3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
- Título:
- 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
- Materia:
- Electrical & Electronics Engineering
- Editor:
- Wiley-IEEE Press
- Descripción:
- 465 p.
- Identificadores:
- E-ISBN: 9781119289647 ISBN: 9781119289654
- Colección:
- Wiley